US PATENT SUBCLASS 216 / 49
.~ Mask resist contains organic compound
Current as of:
June, 1999
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216 /
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ETCHING A SUBSTRATE: PROCESSES
41
DF
MASKING OF A SUBSTRATE USING MATERIAL RESISTANT TO AN ETCHANT (I.E., ETCH RESIST)
{9}
49
.~ Mask resist contains organic compound {1}
50
DF
.~.~
> Mask resist contains a color imparting agent
DEFINITION
Classification: 216/49
Mask resist contains organic compound:
(under subclass 41) Process wherein the resist material contains an organic compound.
(1) Note. See Glossary for a definition of the term Organic.
(2) Note. See subclass 41 for masking material where the patent disclosure is silent as to its chemical nature.