US PATENT SUBCLASS 204 / 298.19
.~.~.~.~.~ Planar magnetron

Current as of: June, 1999
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204 /   HD   CHEMISTRY: ELECTRICAL AND WAVE ENERGY

193  DF  APPARATUS {5}
298.01  DF  .~ Coating, forming or etching by sputtering {2}
298.02  DF  .~.~ Coating {13}
298.16  DF  .~.~.~ Magnetically enchanced {1}
298.17  DF  .~.~.~.~ Flux passes through target surface {3}
298.19.~.~.~.~.~ Planar magnetron {1}
298.2  DF  .~.~.~.~.~.~> Moving magnetic field or target

DEFINITION

Classification: 204/298.19

Planar magnetron:

(under subclass 298.17) Apparatus including a magnetically enhanced generally flat planar sputtering target surface wherein lines of magnetic flux emerge from and return to the flat planar sputtering target surface.