| 118 / | HD | COATING APPARATUS | 
| 
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| 715 | DF | GAS OR VAPOR DEPOSITION {9} | 
| 722 | DF | .~ With treating means (e.g., jarring) {2} | 
| 723 R |  | .~.~ By creating electric field (e.g., gas activation, plasma, etc.) {8} | 
| 723 VE | DF | .~.~.~> Vacuum evaporation means within deposition chamber (e.g., activated reactive evaporation, etc.) {2} | 
| 723 MP | DF | .~.~.~> Multiple gas energizing means associated with one deposition site (i.e., excluding substrate heater as an energizing means) | 
| 723 FE | DF | .~.~.~> Focused electron beam gas energizing means | 
| 723 FI | DF | .~.~.~> Focusing means for ion beam coating material or focused ion beam gas energizing means (i.e., excluding ion plating or ion implanting) | 
| 723 MW | DF | .~.~.~> Microwave gas energizing means (e.g., 2.45 gigahertz, microwave plasma, etc.) {3} | 
| 723 HC | DF | .~.~.~> Hot cathode means for thermionic emission of electrons (e.g., tungsten filament, etc.) {1} | 
| 723 E | DF | .~.~.~> Having glow discharge electrodes (e.g., DC, AC, RF, etc.) {1} | 
| 723 I | DF | .~.~.~> Radio frequency antenna or radio frequency inductive coil discharge means {1} |