US PATENT SUBCLASS 439 / 72
.~.~.~.~ Contacts extending parallel with DIP at contact surface

Current as of: June, 1999
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439 /   HD   ELECTRICAL CONNECTORS

55  DF  PREFORMED PANEL CIRCUIT ARRANGEMENT, E.G., PCB, ICM, DIP, CHIP, WAFER, ETC. {9}
65  DF  .~ With provision to conduct electricity from panel circuit to another panel circuit {4}
68  DF  .~.~ Micro panel circuit arrangement, e.g., ICM, DIP, chip, wafer, etc. {2}
70  DF  .~.~.~ Dual inline package (DIP) {3}
72.~.~.~.~ Contacts extending parallel with DIP at contact surface

DEFINITION

Classification: 439/72

Contacts extending parallel with DIP at contact surface:

(under subclass 70) Electrical connector wherein each of the contacts of the device includes a surface for making electrical engagement with the very small panel circuit arrangement which surface extends generally parallel with the panel of the circuit arrangement.