US PATENT SUBCLASS 439 / 68
.~.~ Micro panel circuit arrangement, e.g., ICM, DIP, chip, wafer, etc.

Current as of: June, 1999
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439 /   HD   ELECTRICAL CONNECTORS

55  DF  PREFORMED PANEL CIRCUIT ARRANGEMENT, E.G., PCB, ICM, DIP, CHIP, WAFER, ETC. {9}
65  DF  .~ With provision to conduct electricity from panel circuit to another panel circuit {4}
68.~.~ Micro panel circuit arrangement, e.g., ICM, DIP, chip, wafer, etc. {2}
69  DF  .~.~.~> Overlying second, coextensive micro panel circuit arrangement
70  DF  .~.~.~> Dual inline package (DIP) {3}

DEFINITION

Classification: 439/68

Micro panel circuit arrangement, e.g.., ICM, DIP, chip, wafer, etc.:

(under subclass 65) Electrical connector wherein one of the panel circuit arrangements is a very small member including more than three electrical contacts and an electrical circuit.

(1) Note. The device of this subclass includes circuitry that is closed as a package in which the circuitry is not readily accessible.

(2) Note. "Very Small Member" is intended to imply that the circuitry is so small that if it were exposed, its details could not ordinarily be seen by the naked eye.