US PATENT SUBCLASS 439 / 55
PREFORMED PANEL CIRCUIT ARRANGEMENT, E.G., PCB, ICM, DIP, CHIP, WAFER, ETC.

Current as of: June, 1999
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439 /   HD   ELECTRICAL CONNECTORS

55PREFORMED PANEL CIRCUIT ARRANGEMENT, E.G., PCB, ICM, DIP, CHIP, WAFER, ETC. {9}
56  DF  .~> Connection to lamp or electron tube {2}
59  DF  .~> With mating connector which receives panel circuit edge {3}
63  DF  .~> For receiving coaxial connector
64  DF  .~> With guide for directing panel circuit movement
65  DF  .~> With provision to conduct electricity from panel circuit to another panel circuit {4}
76.1  DF  .~> Within distinct housing spaced from panel circuit arrangement {1}
77  DF  .~> Flexible panel
78  DF  .~> Distinct contact secured to panel circuit {4}
85  DF  .~> Of layers of insulation

DEFINITION

Classification: 439/55

PREFORMED PANEL CIRCUIT ARRANGEMENT, E.G., PCB, ICM, DIP, CHIP, WAFER, ETC.:

(under the class definition) Electrical connector combined with a prefabricated sheetlike part on which circuit elements are replaced and fixed.

(1) Note. Included herein as a "preformed panel circuit

arrangement" is a printed circuit board (PCB), an integrated circuit module (ICM), a dual-in-line package (DIP), an electronic circuitry "chip", an electronic circuitry "wafer", etc.

SEE OR SEARCH CLASS

29, Metal Working, particularly

829+, for conductor or circuit manufacture on an insulative base (e.g.., printed circuit, etc.).

216, Etching a Substrate: Processes, for combined methods including a chemical etching step in the manufacture of a so-called "printed circuit."

250, Radiant Energy, for similar matter in which significant radio parts or means which coact to tune a circuit or a subcombination thereof are included. 361, Electricity: Electrical Systems and Devices,

600+, for similar subject matter including a significantly identified inductor or capacitor.

427, Coating Processes,

96+, for coating methods for making a printed circuit board.