US PATENT SUBCLASS 439 / 70
.~.~.~ Dual inline package (DIP)

Current as of: June, 1999
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439 /   HD   ELECTRICAL CONNECTORS

55  DF  PREFORMED PANEL CIRCUIT ARRANGEMENT, E.G., PCB, ICM, DIP, CHIP, WAFER, ETC. {9}
65  DF  .~ With provision to conduct electricity from panel circuit to another panel circuit {4}
68  DF  .~.~ Micro panel circuit arrangement, e.g., ICM, DIP, chip, wafer, etc. {2}
70.~.~.~ Dual inline package (DIP) {3}
71  DF  .~.~.~.~> Leadless
72  DF  .~.~.~.~> Contacts extending parallel with DIP at contact surface
73  DF  .~.~.~.~> With external, contact enhancing clamp

DEFINITION

Classification: 439/70

Dual inline package (DIP):

(under subclass 68) Electrical connector comprising a very small panel circuit arrangement on which circuit elements are preplaced and fixed, including first and second parallel straight rows of three or more contacts on or near each of two opposite marginal extremities.

(1) Note. The member with which the electrical connector of

this subclass is to be used includes circuitry that is integrated as a package in which the circuitry is not readily accessible.

(2) Note. "Very small panel circuit arrangement", implies that the member is a prefabricated sheetlike part on which circuit elements are preplaced and fixed (i.e., a printed circuit) and that circuitry is so small that, if it were exposed, its details could not be seen by the naked eye.

SEE OR SEARCH THIS CLASS, SUBCLASS:

264, for a coupling part with actuating means urging contact to move laterally with respect to rest of coupling part and toward mating part comprising a contractile receptacle for receiving a dual inline package (DIP).

330+, for an electrical connector with coupling movement-actuating means or retaining means in addition to contact of coupling part for receiving a dual inline package (DIP).

525, for an electrical connector for a dual inline package (DIP), generally. 526, for an aligning means for a dual inline package (DIP).