US PATENT SUBCLASS 439 / 69
.~.~.~ Overlying second, coextensive micro panel circuit arrangement

Current as of: June, 1999
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439 /   HD   ELECTRICAL CONNECTORS

55  DF  PREFORMED PANEL CIRCUIT ARRANGEMENT, E.G., PCB, ICM, DIP, CHIP, WAFER, ETC. {9}
65  DF  .~ With provision to conduct electricity from panel circuit to another panel circuit {4}
68  DF  .~.~ Micro panel circuit arrangement, e.g., ICM, DIP, chip, wafer, etc. {2}
69.~.~.~ Overlying second, coextensive micro panel circuit arrangement

DEFINITION

Classification: 439/69

Overlying second, coextensive micro panel circuit arrangement:

(under subclass 68) Electrical connector combined with a second very small panel circuit arrangement of substantially the same lateral dimension as the first, and parallel thereto.