| 438 / | HD | SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS |
| FOR 385 | DF | INCLUDING COATING OR MATERIAL REMOVAL, E.G., ETCHING, GRINDING, ETC. (437/ 225) {9} |
| FOR 395 | DF | .~ Of a dielectric or insulative material (437/235) {4} |
| FOR 396 | ![]() | .~.~ Containing Group III atom (437/236) {1} |
| FOR 397 | DF | .~.~.~> By reacting with substrate (437/237) |