US PATENT SUBCLASS 438 / FOR 374
.~.~ Utilizing header (molding surface means) (437/214)

Current as of: June, 1999
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438 /   HD   SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS

FOR 340  DF  MAKING OR ATTACHING ELECTRODE ON OR TO SEMICONDUCTOR, OR SECURING COMPLETED SEMICONDUCTOR TO MOUNTING OR HOUSING (437/180) {13}
FOR 369  DF  .~ Securing completed semiconductor to mounting, housing or external lead (437/209) {6}
FOR 374.~.~ Utilizing header (molding surface means) (437/214)

DEFINITION

Classification: 438/FOR.374

Utilizing header (molding surface means):

Foreign art collection for processes subclass 209 wherein a shape imparting means is used.