US PATENT SUBCLASS 438 / FOR 369
.~ Securing completed semiconductor to mounting, housing or external lead (437/209)

Current as of: June, 1999
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438 /   HD   SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS

FOR 340  DF  MAKING OR ATTACHING ELECTRODE ON OR TO SEMICONDUCTOR, OR SECURING COMPLETED SEMICONDUCTOR TO MOUNTING OR HOUSING (437/180) {13}
FOR 369.~ Securing completed semiconductor to mounting, housing or external lead (437/209) {6}
FOR 370  DF  .~.~> Including contaminant removal (437/210)
FOR 371  DF  .~.~> Utilizing potting or encapsulating material only to surround leads and device to maintain position, i.e. without housing (437/211) {2}
FOR 374  DF  .~.~> Utilizing header (molding surface means) (437/214)
FOR 375  DF  .~.~> Insulating housing (437/215) {4}
FOR 380  DF  .~.~> Lead frame (437/220)
FOR 381  DF  .~.~> Metallic housing (437/221) {3}

DEFINITION

Classification: 438/FOR.369

Securing completed semiconductor to mounting, housing or external lead:

Foreign art collection for processes for attaching an operable semiconductor to a support, e.g., mounting, housing or external lead.