438 / | HD | SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS |
|
FOR 149 | DF | INCLUDING FORMING A SEMICONDUCTOR JUNCTION (437/15) {7} |
FOR 241 | DF | .~ Doping during fluid growth of semiconductor material on substrate (437/81) {25} |
FOR 279 | | .~.~ Sliding liquid phase epitaxy (437/119) {5} |
FOR 280 | DF | .~.~.~> Modifying melt composition (437/120) |
FOR 281 | DF | .~.~.~> Controlling volume or thickness of growth (437/121) |
FOR 282 | DF | .~.~.~> Preliminary dissolving substrate surface (437/122) |
FOR 283 | DF | .~.~.~> With nonlinear slide movement (437/123) |
FOR 284 | DF | .~.~.~> One melt simultaneously contacting plural substrates (437/124) |