438 / | HD | SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS |
|
FOR 149 | DF | INCLUDING FORMING A SEMICONDUCTOR JUNCTION (437/15) {7} |
FOR 221 | DF | .~ Including isolation step (437/61) {4} |
FOR 234 | | .~.~ Isolation by PN junction only (437/74) {4} |
FOR 235 | DF | .~.~.~> By diffusion from upper surface only (437/75) |
FOR 236 | DF | .~.~.~> By up-diffusion from substrate region and down diffusion into upper surface layer (437/76) {1} |
FOR 238 | DF | .~.~.~> By etching and refilling with semiconductor material having diverse conductivity (437/78) |
FOR 239 | DF | .~.~.~> Using polycrystalline region (437/79) |