| 438 / | HD | SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS |
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| FOR 149 | DF | INCLUDING FORMING A SEMICONDUCTOR JUNCTION (437/15) {7} |
| FOR 221 | DF | .~ Including isolation step (437/61) {4} |
| FOR 234 |  | .~.~ Isolation by PN junction only (437/74) {4} |
| FOR 235 | DF | .~.~.~> By diffusion from upper surface only (437/75) |
| FOR 236 | DF | .~.~.~> By up-diffusion from substrate region and down diffusion into upper surface layer (437/76) {1} |
| FOR 238 | DF | .~.~.~> By etching and refilling with semiconductor material having diverse conductivity (437/78) |
| FOR 239 | DF | .~.~.~> Using polycrystalline region (437/79) |