US PATENT SUBCLASS 438 / 68-- .~.~ Substrate dicing

US PATENT SUBCLASS 438 / 68
.~.~ Substrate dicing

Current as of: June, 1999
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438 /	HD	SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS

48	DF	MAKING DEVICE OR CIRCUIT RESPONSIVE TO NONELECTRICAL SIGNAL {5}
57	DF	.~ Responsive to electromagnetic radiation {22}
68		.~.~ Substrate dicing

DEFINITION

Classification: 438/68

Substrate dicing:

(under subclass 57) Process having a step of dividing the semiconductor substrate into multiple separate bodies.

(1) Note. The dicing may be done by any manner, such as

abrading, sawing, etching, cleavage, or a combination thereof.

SEE OR SEARCH CLASS

83, Cutting, for generic processes of cutting a substrate into discrete individual units.

225, Severing by Tearing or Breaking,

1+, for methods.

451, Abrading, for a process of dicing by abrading.