US PATENT SUBCLASS 438 / 675
.~.~.~ Plug formation (i.e., in viahole)

Current as of: June, 1999
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438 /   HD   SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS

584  DF  COATING WITH ELECTRICALLY OR THERMALLY CONDUCTIVE MATERIAL {2}
597  DF  .~ To form ohmic contact to semiconductive material {24}
674  DF  .~.~ Selective deposition of conductive layer {3}
675.~.~.~ Plug formation (i.e., in viahole)

DEFINITION

Classification: 438/675

Plug formation (i.e., in viahole):

(under subclass 674) Processes wherein the selective deposition results in the deposited conductive material being recessed below the top surface of the substrate.