US PATENT SUBCLASS 438 / 661
.~.~.~ Subsequent fusing conductive layer

Current as of: June, 1999
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438 /   HD   SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS

584  DF  COATING WITH ELECTRICALLY OR THERMALLY CONDUCTIVE MATERIAL {2}
597  DF  .~ To form ohmic contact to semiconductive material {24}
660  DF  .~.~ Including heat treatment of conductive layer {2}
661.~.~.~ Subsequent fusing conductive layer {1}
662  DF  .~.~.~.~> Utilizing laser

DEFINITION

Classification: 438/661

Subsequent fusing conductive layer:

(under subclass 660) Processes wherein the conductive layer is melted subsequent to the deposition thereof.