US PATENT SUBCLASS 438 / 64
.~.~ Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor

Current as of: June, 1999
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438 /   HD   SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS

48  DF  MAKING DEVICE OR CIRCUIT RESPONSIVE TO NONELECTRICAL SIGNAL {5}
57  DF  .~ Responsive to electromagnetic radiation {22}
64.~.~ Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor {2}
65  DF  .~.~.~> Having additional optical element (e.g., optical fiber, etc.)
66  DF  .~.~.~> Plural responsive devices (e.g., array, etc.) {1}

DEFINITION

Classification: 438/64

Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor:

(under subclass 57) Process provided including (a) multiple operations having a step of permanently attaching or securing a semiconductive substrate to a terminal, elongated conductor or support (e.g., a mounting, housing, lead frame, discrete heat sink, etc.), (b) multiple operations having a step of shaping flowable plastic or flowable insulative material about a semiconductive substrate, or (c) a step of treating an already mounted or packaged semiconductor substrate (e.g., coating of flowable plastic or flowable insulative material about a semiconductor substrate by dipping, etc.).

(1) Note. The term packaging connotes the integration/assembly of the semiconductive substrate/chip/die with a preformed housing, capsule, or support.

SEE OR SEARCH THIS CLASS, SUBCLASS:

106, for a process of packaging (e.g., with mounting, encapsulating, etc.) or treating a packaged semiconductor device.