US PATENT SUBCLASS 438 / 620
.~.~.~ Forming contacts of differing depths into semiconductor substrate

Current as of: June, 1999
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438 /   HD   SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS

584  DF  COATING WITH ELECTRICALLY OR THERMALLY CONDUCTIVE MATERIAL {2}
597  DF  .~ To form ohmic contact to semiconductive material {24}
618  DF  .~.~ Contacting multiple semiconductive regions (i.e., interconnects) {5}
620.~.~.~ Forming contacts of differing depths into semiconductor substrate

DEFINITION

Classification: 438/620

Forming contacts of differing depths into semiconductor substrate:

(under subclass 618) Processes wherein at least one electrical contact is formed at a depth into the semiconductive substrate which differs from that of another electrical contact.