438 / | HD | SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS |
584 | DF | COATING WITH ELECTRICALLY OR THERMALLY CONDUCTIVE MATERIAL {2} |
597 | DF | .~ To form ohmic contact to semiconductive material {24} |
598 | DF | .~.~ Selectively interconnecting (e.g., customization, wafer scale integration, etc.) {3} |
600 | .~.~.~ Using structure alterable to conductive state (i.e., antifuse) |