US PATENT SUBCLASS 438 / 474
.~.~ Ionized radiation (e.g., corpuscular or plasma treatment, etc.)

Current as of: June, 1999
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438 /   HD   SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS

471  DF  GETTERING OF SUBSTRATE {4}
473  DF  .~ By implanting or irradiating {1}
474.~.~ Ionized radiation (e.g., corpuscular or plasma treatment, etc.) {1}
475  DF  .~.~.~> Hydrogen plasma (i.e., hydrogenization)

DEFINITION

Classification: 438/474

Ionized radiation (e.g., corpuscular or plasma treatment, etc.):

(under subclass 473) Process wherein ionized radiation is applied to the semiconductor substrate to produce a gettering effect.