US PATENT SUBCLASS 438 / 43
.~.~ Tapered etching

Current as of: June, 1999
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438 /   HD   SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS

22  DF  MAKING DEVICE OR CIRCUIT EMISSIVE OF NONELECTRICAL SIGNAL {12}
42  DF  .~ Groove formation {2}
43.~.~ Tapered etching

DEFINITION

Classification: 438/43

Tapered etching:

(under subclass 42) Process wherein the material removal step is by etching the substrate to form a groove with nonparallel sides.