US PATENT SUBCLASS 438 / 114
.~.~.~ Utilizing a coating to perfect the dicing

Current as of: June, 1999
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438 /   HD   SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS

106  DF  PACKAGING (E.G., WITH MOUNTING, ENCAPSULATING, ETC.) OR TREATMENT OF PACKAGED SEMICONDUCTOR {10}
110  DF  .~ Making plural separate devices {2}
113  DF  .~.~ Substrate dicing {1}
114.~.~.~ Utilizing a coating to perfect the dicing

DEFINITION

Classification: 438/114

Utilizing a coating to perfect the dicing:

(under subclass 113) Process including a step of coating the semiconductive substrate to enhance the dicing operation.