| 438 / | HD | SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS |
| 106 | DF | PACKAGING (E.G., WITH MOUNTING, ENCAPSULATING, ETC.) OR TREATMENT OF PACKAGED SEMICONDUCTOR {10} |
| 110 | ![]() | .~ Making plural separate devices {2} |
| 111 | DF | .~.~> Using strip lead frame {1} |
| 113 | DF | .~.~> Substrate dicing {1} |