438 / | HD | SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS |
106 | DF | PACKAGING (E.G., WITH MOUNTING, ENCAPSULATING, ETC.) OR TREATMENT OF PACKAGED SEMICONDUCTOR {10} |
110 | .~ Making plural separate devices {2} | |
111 | DF | .~.~> Using strip lead frame {1} |
113 | DF | .~.~> Substrate dicing {1} |