US PATENT SUBCLASS 438 / 111
.~.~ Using strip lead frame

Current as of: June, 1999
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438 /   HD   SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS

106  DF  PACKAGING (E.G., WITH MOUNTING, ENCAPSULATING, ETC.) OR TREATMENT OF PACKAGED SEMICONDUCTOR {10}
110  DF  .~ Making plural separate devices {2}
111.~.~ Using strip lead frame {1}
112  DF  .~.~.~> And encapsulating

DEFINITION

Classification: 438/111

Using strip lead frame:

(under subclass 110) Process for making plural separate semiconductor devices utilizing a plurality of support structures or positions arranged on an elongated continuum prior to separation.

(1) Note. The continuum may either be the material of the lead frame (e.g., metal strip) or the lead frame may be mounted serially on another continuum (e.g., plastic strip)