US PATENT SUBCLASS 438 / 112
.~.~.~ And encapsulating

Current as of: June, 1999
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438 /   HD   SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS

106  DF  PACKAGING (E.G., WITH MOUNTING, ENCAPSULATING, ETC.) OR TREATMENT OF PACKAGED SEMICONDUCTOR {10}
110  DF  .~ Making plural separate devices {2}
111  DF  .~.~ Using strip lead frame {1}
112.~.~.~ And encapsulating

DEFINITION

Classification: 438/112

And encapsulating:

(under subclass 111) Process including a step of surrounding the semiconductor substrate with an electrically insulating material which forms a sealed encasement therefor.