US PATENT SUBCLASS 438 / 113
.~.~ Substrate dicing

Current as of: June, 1999
Click HD for Main Headings
Click for All Classes

Internet Version by PATENTEC © 1999      Terms of Use


438 /   HD   SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS

106  DF  PACKAGING (E.G., WITH MOUNTING, ENCAPSULATING, ETC.) OR TREATMENT OF PACKAGED SEMICONDUCTOR {10}
110  DF  .~ Making plural separate devices {2}
113.~.~ Substrate dicing {1}
114  DF  .~.~.~> Utilizing a coating to perfect the dicing

DEFINITION

Classification: 438/113

Substrate dicing:

(under subclass 110) Process wherein a semiconductive substrate is divided into discrete individual units.

(1) Note. The dicing may be done by any manner, such as abrading, sawing, etching, cleavage, or a combination thereof.

SEE OR SEARCH THIS CLASS, SUBCLASS:

460, for a process under the class definition of dicing a semiconductor substrate into multiple separate bodies.

SEE OR SEARCH CLASS

83, Cutting, for generic processes of cutting a substrate into discrete individual units.

225, Severing by Tearing or Breaking,

1+, for methods. 451, Abrading, for a process of dicing by abrading.