438 / | HD | SEMICONDUCTOR DEVICE MANUFACTURING: PROCESS |
106 | DF | PACKAGING (E.G., WITH MOUNTING, ENCAPSULATING, ETC.) OR TREATMENT OF PACKAGED SEMICONDUCTOR {10} |
110 | DF | .~ Making plural separate devices {2} |
113 | .~.~ Substrate dicing {1} | |
114 | DF | .~.~.~> Utilizing a coating to perfect the dicing |