US PATENT SUBCLASS 430 / 313
.~.~ With formation of resist image, and etching of substrate or material deposition

Current as of: June, 1999
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430 /   HD   RADIATION IMAGERY CHEMISTRY: PROCESS, COMPOSITION, OR PRODUCT THEREOF

269  DF  IMAGING AFFECTING PHYSICAL PROPERTY OF RADIATION SENSITIVE MATERIAL, OR PRODUCING NONPLANAR OR PRINTING SURFACE - PROCESS, COMPOSITION, OR PRODUCT {17}
311  DF  .~ Making electrical device {3}
313.~.~ With formation of resist image, and etching of substrate or material deposition {5}
314  DF  .~.~.~> Etching of substrate and material deposition
315  DF  .~.~.~> Material deposition only
316  DF  .~.~.~> Multiple etching of substrate
317  DF  .~.~.~> Insulative or nonmetallic dielectric etched
318  DF  .~.~.~> Metal etched

DEFINITION

Classification: 430/313

With formation of resist image, and etching of substrate or material deposition:

(under subclass 311) Processes wherein the image is developed to form a resist image in the medium, and portions of the medium not covered by the resist image are removed or have material deposited thereon.

(1) Note. See (1) Note in subclass 312 for the definition of resist image.

SEE OR SEARCH CLASS

216, Etching a Substrate: Processes, for disclosure (nonclaimed) of forming an image by radiation imagery and involving a claimed post imaging etching process.