US PATENT SUBCLASS 257 / 789
.~.~ With specified filler material

Current as of: June, 1999
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257 /   HD   ACTIVE SOLID-STATE DEVICES (E.G., TRANSISTORS, SOLID-STATE DIODES)

787  DF  ENCAPSULATED {3}
788  DF  .~ With specified encapsulant {6}
789.~.~ With specified filler material

DEFINITION

Classification: 257/789

With specified filler material:

(under subclass 788) Subject matter wherein a particular material has been added to an encapsulant material to give it desirable mechanical, thermal, electrical, or other desirable characteristics, and the material is specified.