US PATENT SUBCLASS 257 / 788
.~ With specified encapsulant

Current as of: June, 1999
Click HD for Main Headings
Click for All Classes

Internet Version by PATENTEC © 1999      Terms of Use


257 /   HD   ACTIVE SOLID-STATE DEVICES (E.G., TRANSISTORS, SOLID-STATE DIODES)

787  DF  ENCAPSULATED {3}
788.~ With specified encapsulant {6}
789  DF  .~.~> With specified filler material
790  DF  .~.~> Plural encapsulating layers
791  DF  .~.~> Including polysiloxane (e.g., silicone resin)
792  DF  .~.~> Including polyimide
793  DF  .~.~> Including epoxide
794  DF  .~.~> Including glass

DEFINITION

Classification: 257/788

With specified encapsulant:

(under subclass 787) Subject matter wherein the chemical composition of the material that encapsulates the active solid-state electronic device is specified.