US PATENT SUBCLASS 257 / 787
ENCAPSULATED


Current as of: June, 1999
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257 /   HD   ACTIVE SOLID-STATE DEVICES (E.G., TRANSISTORS, SOLID-STATE DIODES)

787ENCAPSULATED {3}
788  DF  .~> With specified encapsulant {6}
795  DF  .~> With specified filler material
796  DF  .~> With heat sink embedded in encapsulant


DEFINITION

Classification: 257/787

ENCAPSULATED:

(under the class definition) Subject matter wherein an active solid-state electronic device, often part of a semiconductor chip, is surrounded by an electrically insulating material which forms a sealed encasement therefor.

SEE OR SEARCH THIS CLASS, SUBCLASS:

100, for encapsulated light emitter device.

433+, for light responsive devices with housing or encapsulation.

687, for a housing containing an encapsulant material.

SEE OR SEARCH CLASS

29, Metal Working, particularly

841, and 855 for methods of assembling an electrical component to a base or lead and encapsulating the same. 65, Glass Manufacturing, appropriate subclasses for the

manufacturing of glass encapsulated electronic devices or components thereof.

174, Electricity: Conductors and Insulators,

251, for a printed circuit with an encapsulated wire.

264, Plastic and Nonmetallic Article Shaping or Treating: Processes,

272.11, for encapsulation of electrical components.

343, Communications: Radio Wave Antennas,

873, for embedded, potted, or coated radio wave antennas.

361, Electricity: Electrical Systems and Devices,

600, and 679 for enclosures, including encapsulated types, for electrical and electronic devices.

438, Semiconductor Device Manufacturing: Process, particularly

112, and 127 for methods of encapsulating; see the search notes therein.