US PATENT SUBCLASS 257 / 796
.~ With heat sink embedded in encapsulant

Current as of: June, 1999
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257 /   HD   ACTIVE SOLID-STATE DEVICES (E.G., TRANSISTORS, SOLID-STATE DIODES)

787  DF  ENCAPSULATED {3}
796.~ With heat sink embedded in encapsulant

DEFINITION

Classification: 257/796

With heat sink embedded in encapsulant:

(under subclass 787) Subject matter wherein a heat sink is embedded in the encapsulant.

SEE OR SEARCH CLASS

174, Electricity: Conductors and Insulators, appropriate subclasses.

361, Electricity: Electrical Systems and Devices,

704, thru 723 for thermal conduction means.