US PATENT SUBCLASS 257 / 783
.~.~ With adhesive means

Current as of: June, 1999
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257 /   HD   ACTIVE SOLID-STATE DEVICES (E.G., TRANSISTORS, SOLID-STATE DIODES)

734  DF  COMBINED WITH ELECTRICAL CONTACT OR LEAD {14}
782  DF  .~ Die bond {1}
783.~.~ With adhesive means

DEFINITION

Classification: 257/783

With adhesive means:

(under subclass 782) Subject matter wherein adhesive means (e.g., a layer) is provided to secure a die (chip) which contains an active solid-state electronic device to a supporting member.

SEE OR SEARCH CLASS

156, Adhesive Bonding and Miscellaneous Chemical Manufacture,

60+, for processes of uniting plural bodies via an adhesive material.

438, Semiconductor Device Manufacturing: Process, particularly

118+, for methods of packaging a semiconductor device including a step of bonding utilizing an adhesive material; see the search notes therein.