US PATENT SUBCLASS 257 / 782
.~ Die bond

Current as of: June, 1999
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257 /   HD   ACTIVE SOLID-STATE DEVICES (E.G., TRANSISTORS, SOLID-STATE DIODES)

734  DF  COMBINED WITH ELECTRICAL CONTACT OR LEAD {14}
782.~ Die bond {1}
783  DF  .~.~> With adhesive means

DEFINITION

Classification: 257/782

Die bond:

(under subclass 734) Subject matter wherein a semiconductor chip containing at least one active solid-state device and provided with a contact or lead is provided with a means for attaching the chip to a supporting member.

(1) Note. The supporting member or attachment may form part of the contacts or leads for the chip, or be separate therefrom.