US PATENT SUBCLASS 257 / 748
.~.~.~ Plural layers of specified contact or lead material

Current as of: June, 1999
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257 /   HD   ACTIVE SOLID-STATE DEVICES (E.G., TRANSISTORS, SOLID-STATE DIODES)

734  DF  COMBINED WITH ELECTRICAL CONTACT OR LEAD {14}
741  DF  .~ Of specified material other than unalloyed aluminum {10}
747  DF  .~.~ With thermal expansion matching of contact or lead material to semiconductor active device {1}
748.~.~.~ Plural layers of specified contact or lead material

DEFINITION

Classification: 257/748

Plural layers of specified contact or lead material:

(under subclass 747) Subject matter wherein the thermal expansion matching lead material is layered.