US PATENT SUBCLASS 257 / 738
.~.~ Ball shaped

Current as of: June, 1999
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257 /   HD   ACTIVE SOLID-STATE DEVICES (E.G., TRANSISTORS, SOLID-STATE DIODES)

734  DF  COMBINED WITH ELECTRICAL CONTACT OR LEAD {14}
737  DF  .~ Bump leads {1}
738.~.~ Ball shaped

DEFINITION

Classification: 257/738

Ball shaped:

(under subclass 737) Subject matter wherein the bump contacts have the spherical shape of a ball.

SEE OR SEARCH THIS CLASS, SUBCLASS:

780, for ball shaped bonds, generally.