US PATENT SUBCLASS 257 / 737
.~ Bump leads

Current as of: June, 1999
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257 /   HD   ACTIVE SOLID-STATE DEVICES (E.G., TRANSISTORS, SOLID-STATE DIODES)

734  DF  COMBINED WITH ELECTRICAL CONTACT OR LEAD {14}
737.~ Bump leads {1}
738  DF  .~.~> Ball shaped

DEFINITION

Classification: 257/737

Bump leads:

(under subclass 734) Subject matter wherein an electrical contact is in the form of a relatively abrupt protuberance on the surface of a solid-state electronic device or chip/die containing such a device.