US PATENT SUBCLASS 257 / 736
.~.~ Layered

Current as of: June, 1999
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257 /   HD   ACTIVE SOLID-STATE DEVICES (E.G., TRANSISTORS, SOLID-STATE DIODES)

734  DF  COMBINED WITH ELECTRICAL CONTACT OR LEAD {14}
735  DF  .~ Beam leads (i.e., leads that extend beyond the ends or sides of a chip component) {1}
736.~.~ Layered

DEFINITION

Classification: 257/736

Layered:

(under subclass 735) Subject matter wherein the leads are made of at least two separate layers of the same or different material.