US PATENT SUBCLASS 257 / 735
.~ Beam leads (i.e., leads that extend beyond the ends or sides of a chip component)

Current as of: June, 1999
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257 /   HD   ACTIVE SOLID-STATE DEVICES (E.G., TRANSISTORS, SOLID-STATE DIODES)

734  DF  COMBINED WITH ELECTRICAL CONTACT OR LEAD {14}
735.~ Beam leads (i.e., leads that extend beyond the ends or sides of a chip component) {1}
736  DF  .~.~> Layered

DEFINITION

Classification: 257/735

Beam leads (i.e., leads that extend beyond the ends or sides of a chip component):

(under subclass 734) Subject matter wherein electrical contact leads extend like beams beyond the ends of a chip component.

SEE OR SEARCH CLASS

438, Semiconductor Device Manufacturing: Process, particularly

411, for methods of forming electrically isolated semiconductor islands held in place by beam lead metallization; subclass 461 for methods of forming beam leads on a semiconductor substrate combined with dicing of the substrate into plural separate bodies; and subclass 611 for methods of forming beam lead metallization on a semiconductor substrate.