US PATENT SUBCLASS 257 / 707
.~.~.~ Directly attached to semiconductor device

Current as of: June, 1999
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257 /   HD   ACTIVE SOLID-STATE DEVICES (E.G., TRANSISTORS, SOLID-STATE DIODES)

678  DF  HOUSING OR PACKAGE {18}
701  DF  .~ Insulating material {5}
706  DF  .~.~ With heat sink {1}
707.~.~.~ Directly attached to semiconductor device

DEFINITION

Classification: 257/707

Directly attached to semiconductor device:

(under subclass 706) Subject matter wherein the heat sink is attached directly to the semiconductor device.