US PATENT SUBCLASS 257 / 706
.~.~ With heat sink

Current as of: June, 1999
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257 /   HD   ACTIVE SOLID-STATE DEVICES (E.G., TRANSISTORS, SOLID-STATE DIODES)

678  DF  HOUSING OR PACKAGE {18}
701  DF  .~ Insulating material {5}
706.~.~ With heat sink {1}
707  DF  .~.~.~> Directly attached to semiconductor device

DEFINITION

Classification: 257/706

With heat sink:

(under subclass 701) Subject matter wherein the insulating housing has a heat sink to dissipate heat.

(1) Note. The heat sink may be located in a cavity in a base member made of ceramic material.

SEE OR SEARCH CLASS

174, Electricity: Conductors and Insulators, appropriate subclasses directed to cooling means.

361, Electricity: Electrical Systems and Devices,

688, 723 for cooling means for electronic devices or components with housings or mounting assemblies.