US PATENT SUBCLASS 257 / 633
.~.~ With thermal expansion compensation (e.g., thermal expansion of glass passivant matched to that of semiconductor)

Current as of: June, 1999
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257 /   HD   ACTIVE SOLID-STATE DEVICES (E.G., TRANSISTORS, SOLID-STATE DIODES)

629  DF  WITH MEANS TO CONTROL SURFACE EFFECTS {4}
632  DF  .~ Insulating coating {8}
633.~.~ With thermal expansion compensation (e.g., thermal expansion of glass passivant matched to that of semiconductor)

DEFINITION

Classification: 257/633

With thermal expansion compensation (e.g., thermal expansion of glass passivant matched to that of semiconductor):

(under subclass 632) Subject matter wherein the insulating coating includes means to compensate for mismatches in thermal expansion coefficient between different portions of the device, such as forming the insulating coating of a material which closely matches the thermal expansion coefficient of the underlying semiconductor.

(1) Note. Typical semiconductor materials, such as silicon, have extremely low thermal expansion coefficients, and thus, low thermal expansion materials such as Corning Code 7740 PYREX TM borosilicate glass closely match the expansion coefficient of the semiconductor, and help to prevent thermal expansion induced stress or cracking.