US PATENT SUBCLASS 257 / 522
.~.~ Air isolation (e.g., beam lead supported semiconductor islands)

Current as of: June, 1999
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257 /   HD   ACTIVE SOLID-STATE DEVICES (E.G., TRANSISTORS, SOLID-STATE DIODES)

499  DF  INTEGRATED CIRCUIT STRUCTURE WITH ELECTRICALLY ISOLATED COMPONENTS {9}
506  DF  .~ Including dielectric isolation means {7}
522.~.~ Air isolation (e.g., beam lead supported semiconductor islands)

DEFINITION

Classification: 257/522

Air isolation (e.g., beam lead supported semiconductor islands):

(under subclass 506) Subject matter wherein the isolation means is air (e.g., islands of semiconductor material supported by beam leads and separated by air).

SEE OR SEARCH CLASS

438, Semiconductor Device Manufacturing: Process, particularly

411, for methods of forming electrically isolated semiconductor islands held in place by beam lead metallization; subclass 461 for methods of forming beam leads on a semiconductor substrate combined with dicing of the substrate into plural separate bodies; and subclass 611 for methods of forming beam lead metallization on a semiconductor substrate.