US PATENT SUBCLASS 257 / 178-- .~.~ With means to avoid stress between electrode and active device (e.g., thermal expansion matching of electrode to semiconductor)

US PATENT SUBCLASS 257 / 178
.~.~ With means to avoid stress between electrode and active device (e.g., thermal expansion matching of electrode to semiconductor)

Current as of: June, 1999
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257 /	HD	ACTIVE SOLID-STATE DEVICES (E.G., TRANSISTORS, SOLID-STATE DIODES)

107	DF	REGENERATIVE TYPE SWITCHING DEVICE (E.G., SCR, COMFET, THYRISTOR) {19}
177	DF	.~ With housing or external electrode {3}
178		.~.~ With means to avoid stress between electrode and active device (e.g., thermal expansion matching of electrode to semiconductor) {1}
179	DF	.~.~.~> With malleable electrode (e.g., silver electrode layer)

DEFINITION

Classification: 257/178

With means to avoid stress between electrode and active device (e.g., thermal expansion matching of electrode to semiconductor):

(under subclass 177) Subject matter wherein the device has electrode means connected to its terminals and is further provided with means to avoid creation of stress between the active device and the electrode means.

(1) Note. The means to avoid such stress may include means to thermally match the electrode to the semiconductor.

SEE OR SEARCH CLASS

439, Electrical Connectors,

449+, for stress relief means for a conductor-to-terminal joint.