US PATENT SUBCLASS 228 / 180.22
.~.~.~.~.~ Lead-less (or "bumped") device

Current as of: June, 1999
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228 /   HD   METAL FUSION BONDING

101  DF  PROCESS {38}
178  DF  .~ Plural joints {9}
179.1  DF  .~.~ Of electrical device (e.g., semiconductor) {2}
180.1  DF  .~.~.~ Simultaneous bonding of multiple joints (e.g., dip soldering of printed circuit boards) {1}
180.21  DF  .~.~.~.~ Component terminal to substrate surface (i.e., nonpenetrating terminal) {1}
180.22.~.~.~.~.~ Lead-less (or "bumped") device

DEFINITION

Classification: 228/180.22

Lead-less (or "bumped") device:

(under subclass 180.21) Process wherein the terminal extends above the surface of the substrate.