US PATENT SUBCLASS 228 / 179.1
.~.~ Of electrical device (e.g., semiconductor)

Current as of: June, 1999
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228 /   HD   METAL FUSION BONDING

101  DF  PROCESS {38}
178  DF  .~ Plural joints {9}
179.1.~.~ Of electrical device (e.g., semiconductor) {2}
180.1  DF  .~.~.~> Simultaneous bonding of multiple joints (e.g., dip soldering of printed circuit boards) {1}
180.5  DF  .~.~.~> Wire bonding

DEFINITION

Classification: 228/179.1

Of electrical device (e.g., semiconductor):

(under subclass 178) Process for the manufacture of product members intended to be used in the transmission or regulation of electrical energy.

(1) Note. This subclass serves as a collecting place for cross-references of patents directed to the manufacture of a semiconductor device even though only a single joint is formed, except when bonding a metal to a nonmetal with a metallic filler.

SEE OR SEARCH THIS CLASS, SUBCLASS:

4.5, for means for bonding a terminal(s) to an electrical device.

123.1, for bonding of a semiconductor device involving uniting a metal to a nonmetal utilizing a metallic filler.

SEE OR SEARCH CLASS

29, Metal Working, 592.1+, for the manufacture of an electrical device wherein fusion bonding is combined with an additional operation not incidental to the bonding operation.

438, Semiconductor Device Manufacturing: Process, particularly

26+, 51, 55, 64+, and 106+ for methods of packaging a semiconductor device; see the search notes thereunder.