US PATENT SUBCLASS 228 / 180.5
.~.~.~ Wire bonding

Current as of: June, 1999
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228 /   HD   METAL FUSION BONDING

101  DF  PROCESS {38}
178  DF  .~ Plural joints {9}
179.1  DF  .~.~ Of electrical device (e.g., semiconductor) {2}
180.5.~.~.~ Wire bonding

DEFINITION

Classification: 228/180.5

Wire bonding:

(under subclass 179.1) Process of fusion bonding a small strand member to another member.