US PATENT SUBCLASS 228 / 178
.~ Plural joints

Current as of: June, 1999
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228 /   HD   METAL FUSION BONDING

101  DF  PROCESS {38}
178.~ Plural joints {9}
179.1  DF  .~.~> Of electrical device (e.g., semiconductor) {2}
181  DF  .~.~> Honeycomb structure
182  DF  .~.~> Of mechanical article {2}
185  DF  .~.~> Noncoextensive lamina to common base in regular pattern
186  DF  .~.~> Preliminary sealing of joints
187  DF  .~.~> Separate successive bonds at different temperatures
188  DF  .~.~> Including nonmetallic base
189  DF  .~.~> Using bridge or spacer
190  DF  .~.~> Of concurrently bonded stacked laminae

DEFINITION

Classification: 228/178

(under subclass 101) Process which includes securing together a plurality of distinct pairs of meeting faces.

(1) Note. Bonding at several locations between a single pair of meeting faces (e.g., spot welding along a pair of overlapped margins or bonding a corrugated panel to a planar panel in face-to-face relation) is not considered to meet the requirements of this and the indented subclasses.