228 / | HD | METAL FUSION BONDING |
101 | DF | PROCESS {38} |
178 | DF | .~ Plural joints {9} |
179.1 | DF | .~.~ Of electrical device (e.g., semiconductor) {2} |
180.1 | DF | .~.~.~ Simultaneous bonding of multiple joints (e.g., dip soldering of printed circuit boards) {1} |
180.21 | .~.~.~.~ Component terminal to substrate surface (i.e., nonpenetrating terminal) {1} | |
180.22 | DF | .~.~.~.~.~> Lead-less (or "bumped") device |