US PATENT SUBCLASS 216 / 94
.~ Etching using radiation (e.g., laser, electron-beam, ion-beam, etc.)

Current as of: June, 1999
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216 /   HD   ETCHING A SUBSTRATE: PROCESSES

83  DF  NONGASEOUS PHASE ETCHING OF SUBSTRATE {9}
94.~ Etching using radiation (e.g., laser, electron-beam, ion-beam, etc.)

DEFINITION

Classification: 216/94

Etching using radiation (e.g., laser, electron-beam, ion-beam, etc.):

(under subclass 83) Process wherein radiation is used separately or simultaneously during etching.