US PATENT SUBCLASS 216 / 92
.~ Projecting etchant against a moving substrate or controlling the angle or pattern projection of the etchant or controlling the angle or pattern of movement of the substrate

Current as of: June, 1999
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216 /   HD   ETCHING A SUBSTRATE: PROCESSES

83  DF  NONGASEOUS PHASE ETCHING OF SUBSTRATE {9}
92.~ Projecting etchant against a moving substrate or controlling the angle or pattern projection of the etchant or controlling the angle or pattern of movement of the substrate

DEFINITION

Classification: 216/92

Projecting etchant against a moving substrate or controlling the angle or pattern projection of the etchant or controlling the angle or pattern of movement of the substrate:

(under subclass 83) Process wherein an etchant is transported through space by mechanical force and (a) brought into contact with a substrate while the substrate is in motion, (b) the etchant or substrate is transported at a predetermined angle, or (c) the etchant or substrate is transported in a particular pattern.